The project, hosted by the National Manufacturing Institute Scotland, aims to reshore a critical part of the UK’s £500 million electrification supply chain and create new opportunities for manufacturers to access new markets and cut costs.
A Major Step for UK Semiconductor Manufacturing
Funded by Innovate UK and set to open in 2025, the new development will be located in Inchinnan, Renfrewshire, forming part of the University of Strathclyde’s Advanced Net Zero Innovation Centre (ANZIC). The initiative will provide an advanced packaging scale-up line for power electronic semiconductors, making it the first of its kind in Europe. This capability will significantly reduce packaging times for UK firms, cutting production from months to just days.
The Role of Semiconductors in Modern Technology
Semiconductors play a crucial role in modern life, powering essential technologies like renewable energy systems, advanced computing, data storage, wireless communication, and the automotive sector. However, global material shortages, limited manufacturing capacity, and a lack of innovation facilities have left the UK reliant on international markets, causing long delays.
Addressing Packaging Challenges in Semiconductor Production
Packaging is a key stage in semiconductor manufacturing, ensuring core components are protected and ready for various technologies. The process is evolving to accommodate more devices and functionalities within single packages. The UK’s semiconductor packaging market, currently valued at £500 million and employing 15,000 people, is projected to reach £750 million by 2030. The National Manufacturing Institute Scotland facility is expected to further accelerate this growth.
Supporting UK Companies with Advanced Packaging Solutions
The NMIS scale-up packaging line will support UK companies in developing new solutions and expanding the use of UK-manufactured wafers – thin slices of semiconductor material used in electronic circuits. By addressing critical production gaps, manufacturing firms can potentially unlock access to the growing semiconductor market, reinforcing Scotland’s position as a hub for advanced manufacturing and innovation.
Industry Leaders on the Impact of the NMIS Facility
Professor Matt Boyle, Director of Electrification at National Manufacturing Institute Scotland, stated: “At the NMIS, we work with manufacturers of all sizes to help them boost productivity and efficiency. We’re excited to help grow the semiconductors supply chain here in the UK and secure a lead in sector innovation.
“Working closely with the Compound Semiconductor Applications (CSA) Catapult, our focus is on highly specialised packaging, using our established engineering expertise to stay ahead of rising demand. Facilities and equipment for packaging have until now been the missing piece of the puzzle, and the new packaging line unlocks the potential to reshore manufacturing to the UK.
“This is just the beginning – our aim is to accelerate semiconductor manufacturing, allowing companies to explore new technologies and implement testing without disrupting day-to-day production. We look forward to collaborating with firms from across the supply chain and within our vast network, including the High Value Manufacturing (HVM) Catapult.”
Professor Sir Jim McDonald, Principal and Vice-Chancellor of the University of Strathclyde, said: “Strathclyde is delighted to be at the heart of this vital new investment and technology development initiative, which will strengthen the UK’s semiconductor supply chain and accelerate the journey towards net zero.
“As the operator of NMIS, we are committed to driving innovation and supporting industry in the transition to more sustainable and resilient manufacturing. By leveraging our world-class research, technical expertise and facilities, this initiative will enhance the UK's technological capabilities, create high-value opportunities for businesses, and reinforce Scotland’s position as a global leader in advanced manufacturing.”
Martin McHugh, Chief Executive Officer at CSA Catapult, added: “This new facility will allow semiconductor and packaging companies to try and test new ideas, helping to de-risk the commercialisation process and bring their products and solutions to market quicker.
“The facility will also allow us to expand the capabilities and relationships built under the Driving the Electric Revolution programme, working closely with colleagues from NMIS to take innovative packaging solutions developed at CSA Catapult into a state-of-the-art scale-up facility in Scotland.
“This transformation of ideas into products will be the key to unlocking the full growth potential of the UK's semiconductor industry, helping to further develop our world-leading strengths in advanced packaging across a range of industries.”
